A method of preparing an optical connector and optical devices comprising the optical connector thus

专利摘要:
The invention relates to a method for preparing an optical connector located within a gap between a first optical assembly (20) and a second optical assembly (40). The optical connector comprises a contrast layer having at least one cured bridge portion (62) and at least one uncured bridge portion formed of a first composition having a first refractive index R1. The method comprises applying a second composition having a second refractive index RI 2 on the contrast layer to form a second layer and mixing at least a portion of the second layer with the at least one non-refractive portion. cured of the contrast layer to form at least a mixed portion having a third refractive index R1, wherein R1 1> R1 3> RI 2, and then curing the mixed portion and a second optional layer, so that each of the at least one hardened bridge portions is surrounded by a mixed and optional second layer. The invention also relates to an optical device comprising an optical connector prepared according to the method of the invention.
公开号:CH710969B1
申请号:CH01067/16
申请日:2015-01-22
公开日:2019-08-30
发明作者:Martin Amb Chad；L Jarzabkowski Dale；Swatowski Brandon；Kenneth Weidner William
申请人:Dow Corning；
IPC主号:

专利说明:

Description: The present invention relates generally to methods for preparing optical connectors and to the optical connectors thus prepared.
Various techniques have been used to optically interconnect optical devices such as fiber optic devices and polymer waveguide devices. For example, in some systems, precision micromoulds are created to hold the optical fibers in place and the fibers are then cleaved, bonded, laid and polished to create enough interfaces for interconnection. Likewise, polymer waveguide connection systems have been created using similar techniques such as precision alignment and laser ablation. Such systems, however, require precise alignment of the two optical systems in order to interconnect the optical fibers and the polymer waveguides.
More recently, it has been shown that other methods create optical connection systems (i.e., optical connectors) that do not require precise alignment of the optical devices. For example, the recent use of self-writing polymerization of polymer bridges creates polymer bridges between optical devices that do not require precision alignment. However, self-written polymer bridges are based on a unique hardened polymeric material with a unique refractive index. In the absence of contrast in the refractive index of these materials, the propagation of electromagnetic radiation (i.e., one or more electromagnetic waves) through each of the self-written polymer bridges is ineffective , and it may therefore be necessary to introduce a separate coating material, having a lower refractive index than the self-written polymer bridge, around the self-written polymer bridge to increase the efficiency of the propagation of electromagnetic waves. The introduction of a coating material to increase the efficiency of the propagation of electromagnetic waves adds additional manufacturing costs and time to the manufacturing process of optical connection devices.
The present invention facilitates the alignment of optical devices and a simple manufacturing technique, while also addressing the efficiency of the propagation of electromagnetic waves through optical interconnection systems.
Summary of the invention The present invention provides a method for preparing an optical connector which can be used to connect a respective element of at least one optical element of a first optical assembly to a corresponding element of at least one element. optics of a second optical assembly, in which one or more electromagnetic waves can be guided between the respective element of the at least one optical element of the first optical assembly and the corresponding element of at least one optical element of the second assembly optical.
The optical connector is located in a space between the first optical assembly and the second optical assembly and includes a contrast layer having at least one part of hardened bridge and at least one part not hardened, in which each of the au at least one hardened bridge portion extends continuously from a terminal end of one of the at least one optical element of the first optical assembly to a corresponding terminal end of a respective element of the at least one optical element of the second optical assembly. In addition, the contrast layer is formed of a first composition having a first refractive index (RI ¹ ).
The method of the present invention comprises applying a second composition having a second refractive index (RI ² ) on the contrast layer to form a second layer and mixing at least part of the second layer with the at least one uncured part of the contrast layer to form at least one mixed part having a third refractive index (RI ³ ) in the contrast layer. In this method, each of the at least one hardened bridge part is at least partially surrounded by one of the at least one mixed part between the terminal end of one of the at least one optical element of the first optical assembly and the end corresponding terminal of the respective element of the at least one optical element of the second optical assembly.
The method further comprises applying a second hardening condition to harden the at least one mixed part.
In this method, the first and second compositions and the at least one mixed part are different from each other. In addition, the refractive indices of the first and second composition and the at least one mixed part are different from each other and in which RI ¹ > RI ³ > RI ² when measured at the same length of wave and temperature.
The present invention also relates to optical devices comprising the optical connectors prepared from the present invention.
The advantages of preparing optical connectors according to the method of the present invention and associated optical devices including optical connectors prepared in this way according to the present invention take many forms. The precision alignment requirements of the optical connectors will be reduced as will the system misalignment tolerances since the interface of the hardened bridge part will conform in size and shape to the size and shape of the respective terminal ends of the optical element on which it is aligned. In addition, polishing is unlikely to be necessary as the smooth, non-diffusing surfaces of one
CH 710 969 B1 optical elements are based on models or molded on the hardened bridge part, thus leaving a smooth and non-diffusing surface when disconnected. In addition, the contrast between the hardened bridge parts with a higher refractive index and the hardened composite layer with a lower refractive index allows the electromagnetic radiation to be guided along the length of the hardened bridge parts resulting in minimal losses. to the hardened mixed layer that surrounds it. Furthermore, the manufacturing process for forming the optical connectors is simple and reproducible for the manufacture of optical connectors assisting in the coupling of a wide variety of optical devices.
BRIEF DESCRIPTION OF THE DRAWINGS Other advantages and aspects of this invention can be described in the following detailed description when examined in the context of the appended drawings in which:
fig. 1 fig. 2 to 6 fig. 7 to 9 fig. 10 fig. 11 fig. 12In fig. 12B fig. 13 fig. 14 fig. 15 fig. 16 fig. 17 illustrates a perspective view of an optical device comprising an optical connector according to an embodiment of the present invention;
illustrate perspective views at different stages of a method of forming an optical connector and an associated optical device of FIG. 1, according to an embodiment of the present invention;
illustrate perspective views at different stages of a method for forming a second optical device of a first optical device comprising an optical connector according to an embodiment of the present invention;
illustrates a perspective view of an optical device including an optical connector having a plurality of hardened bridge parts according to another embodiment of the present invention;
illustrates a perspective view of an optical device including an optical connector having a plurality of hardened bridge parts according to yet another embodiment of the present invention;
illustrates a perspective view of an optical device including a first inclined optical element and an inclined optical connector according to another embodiment of the present invention;
illustrates a perspective view of an optical device with a first optical element having a curved terminal end according to another embodiment of the present invention illustrates a perspective view of an optical device including an optical connector formed between the optical devices having misaligned optical elements according to another embodiment of the present invention;
illustrates a perspective view of a step in the process for forming the hardened bridge portion of the optical connector of FIG. 13;
is a phase contrast microscopy image of a single hardened bridge portion coupled to a polymer waveguide formed in accordance with an embodiment of the present invention;
is a phase contrast microscopy image of a plurality of hardened bridge portions coupled to corresponding polymer waveguides formed in accordance with an embodiment of the present invention; and is a phase contrast microscopy image of an end view of one of the hardened bridge parts in a hardened composite part according to an embodiment of the present invention.
Detailed description of the invention The present invention provides a method for preparing an optical connector intended to connect a respective element of at least one optical element of a first optical assembly to a corresponding element of at least one optical element of a second optical assembly to form an optical device. The present invention also provides a method for forming a second optical device from the first optical device, including the prepared optical connector.
The method and the optical connector of the invention can be used for passive system elements and active system elements. The following are examples of passive and active system elements: unbranched type optical waveguides, wavelength division multiplexers [WDM], branched optical waveguides, optical adhesives or elements transmitting similar passive light, optical waveguide switches, optical attenuators and optical amplifiers or similar active elements transmitting light. Other examples of suitable articles and applications in which the method and article can be used include phase arrays
CH 710 969 B1 volumetric, Bragg gratings, Mach Zhender interferometers, lenses, amplifiers, cavities for lasers, acousto-optical devices, modulators and dielectric mirrors.
If we refer to fig. 1, the optical device 15 formed according to the method of the present invention includes a first optical assembly 20 having at least one optical element 22 (represented by an optical element 22 in FIG. 1) positioned in a sheath 23, which is positioned in a housing of 25. As best shown in fig. 2, each of the at least one optical element 22 comprises a terminal end 24 ending at a first optical interface 26.
Again in FIG. 1, the optical device 15 includes a second optical assembly 40 having at least one optical element 42 (represented by an optical element 42 in FIG. 1) positioned in a sheath 44, which is positioned in a housing 45. As shown in the better fig. 2, each of the at least one optical element 42 includes a terminal end 48 ending at a second optical interface 50. Preferably, the housing 25 of the first optical assembly 20 is coupled to, or otherwise fixed to, or integral with the housing 45 of the second optical assembly 40.
In some embodiments, also illustrated in FIG. 1, the second optical assembly 40 also comprises a substrate 47 which is positioned in the housing 45.
By the term "optical element", as in the optical element 22 or optical element 42 in FIG. 1 means any device or material which is capable of guiding one or more electromagnetic waves (such as, for example, one or more light waves in the spectrum of ultraviolet light or one or more light waves in the spectrum of visible light ) over its entire length. Suitable examples of optical elements which may include at least one optical element 22 and / or the at least one optical element 42 include, but are not limited to optical fibers, polymer waveguides, lenses, transmission modules , reception modules, transceivers (modules including transmission and reception modules).
Corresponding optical assemblies, such as the first or the second optical assembly 20, 40, in FIG. 1 which include optical elements 22 or 42 in this way can therefore come in many forms, including the many commercially available forms. Suitable commercially available optical assemblies including optical fibers as optical elements 22 or 42, for example, which may include optical assembly 20 or 40 include, but are not limited to, optical connectors such as Avio , ADT-UNI, DMI, E-2000 (AKA LSH), EC, F07, F-3000, FC, Fibergate, FSMA, LC, ELIO, LX-5, MIC, MPO / MTP, MT, MT-RJ, MU , Opti-Jack, SC, SMA 905, SMA 906, SMC, ST / BFOC, TOSLINK, VF-45, 1053 HDTV and V-PIN.
Although an optical element 22 and an optical element 42 appear in many of the figures, it can be seen that more than one optical element 22 can be included in the first optical assembly 20 and more than one optical element 42 can be included in the second optical assembly 40, as illustrated in FIG. 10. When more than one optical element 22 or 42 is used, these optical elements 22 or 42 may all be of the same type (ie this is a non-limiting example in which all the elements at least one optical element 22 may be optical fibers) or they may be of different types (i.e., this is a non-limiting example in which an optical element 22 is an optical fiber and another optical element 22 is a polymer waveguide).
In some embodiments, the number of optical elements 22 in the first optical assembly 20 corresponds to the number of optical elements 42 in the second optical assembly 40. However, in other arrangements, the number of elements optics 22 in the first optical assembly 20 may be different from the number of optical elements 42 in the second optical assembly 40, but further includes wherein at least one of the optical elements 22 is coupled to a corresponding element of the optical elements 42 through a hardened bridge part 62, as illustrated in FIG. 11 and as described below.
In some embodiments, the optical element 22 is identical to the optical element 42, while in the other embodiments the optical element 22 is different from the optical element 42. Thus, for example, in which there is only one optical element 22 and an optical element 42, the optical element 22 and the optical element 42 may be an optical fiber, or alternatively the optical element 22 may be an optical fiber then that the optical element 42 may be a polymer waveguide, a lens, a transmission module, a reception module or a transmitter / receiver. Likewise, in which there is only one optical element 22 and only one optical element 42, the optical element 42 can be an optical fiber, and the optical element 22 can be a polymer waveguide , a lens, a transmission module, a reception module or a transmitter / receiver. Likewise, in which the number of optical elements 22 and optical elements 42 is two or more, each of the at least two optical elements 22 or 42 can be the same or different, and each of the at least two optical elements 22 can be identical or different from at least two respective optical elements 42.
In addition, in certain embodiments in which the at least one optical element 22 includes optical fibers, the number of optical fibers can vary from 1 to 144 optical fibers or more, such as from 1 to 72 optical fibers. .
In embodiments including more than one optical element 22 or more than one optical element 42, it should also be appreciated that the relative size and shape of one or more optical elements 22 or 42 may be the same or different in length and cross-sectional shape. In addition, the size and shape of such optical elements 22 or 42 are not limited to the size and shape illustrated in the figures. So, for example, the optical element
CH 710 969 B1 may be an optical fiber having a cylindrical shape and an essentially round cross section, while the optical element 42 may be a polymer waveguide which is of rectangular cross section.
While the optical elements 22 and 42 are generally indicated as being rectilinear over their respective length and extending perpendicular to their respective optical interfaces 26 and 50, the configuration of the optical elements 22 and 42 is not limited to the arrangement as illustrated in FIG. 1. For example, one or more of the at least one optical element 22 or 42 may extend towards their respective optical interface 26 or 50 at an angle other than perpendicular to the respective optical interface 26 or 50, as indicated, for example , in fig. 12A (with the hardened bridge part 62 also inclined to connect the inclined optical element 22 to the optical element 42). While the angle of the first optical element 22 and the bridge part 62 are generally indicated as extending downwards (from left to right) with a reduced angle relative to the horizontal as in fig. 12A, the angle may be slightly upward in other embodiments, or the angle may be greater with respect to the horizontal in an upward or downward direction (as illustrated in the figures of left to right) and nevertheless fall under the present invention.
While the respective terminal end 24 or 48 of the optical elements 22 or 42 is generally flat and vertical as illustrated in FIGS. 1-11, in some embodiments, one or both of the terminal ends 24 or 48 can take any variety of forms. For example, as shown for example in fig. 12B, the terminal end 24B of the first optical element 22 can be curved and the corresponding first terminal end 64B formed to correspond to the curved terminal end 24B. Although not indicated, the terminal end 48 of the second optical element 42 (and the corresponding terminal end 68 of the bridge part 62) can also be curved (or can be flat as illustrated in FIG. 12B). The relative amount of curvature of the curved terminal end 24B, as shown in fig. 12B, may be as illustrated, or may be slightly more or less deep than illustrated in FIG. 12B and nevertheless fall under the present invention. In addition, one or more of the optical elements 22 or 42 may both be inclined and have terminal ends 22 or 42 curved or having other shapes and fall within the scope of the present invention.
Referring to FIG. 1, the optical device 15 also includes an optical connector 30. The optical connector 30 includes at least one bridge part 62, each bridge part 62 having a first terminal end 64 which is coupled to the terminal end 24 of the element optic 22 and having a second terminal end 66 which is coupled to a terminal end 48 of the corresponding element of the optical elements 42. Each bridge part 62 guides one or more electromagnetic waves between the respective element of the at least one element optic 22 of the first optical assembly 20 and the corresponding element of at least one optical element 42 of the second optical assembly 40 when the optical connector 30 is coupled to the first optical assembly 20 and to the second optical assembly 40.
The optical connector 30 also includes at least one mixed part 70 which partially surrounds the length of each of the respective point parts 62 of the first terminal end 64 respective to the second terminal end 66 of the bridge part 62 (c. i.e., from the terminal end 24 of the optical element 22 to the terminal end 48 of the corresponding optical element 44), but does not surround the first terminal end 64 and the second terminal end 66 ( i.e. the mixed part 70 is not located and is not in contact with the respective end ends 64, 66 of the bridge part 62). In certain embodiments, a second part 72 is present and, in such embodiments, in addition to the mixed part 70, the second part 72 may partially surround the length of one or more of the at least one bridge parts 62 so that the mixed part 70 and the second part completely surround the respective bridge part. The expression "at least partially surrounds the length", as used herein, defines the place on which the respective composition is not disposed and in contact with the respective bridge part 62 along its entire surface exterior between the first terminal end 64 and the second terminal end. Thus, in certain embodiments, the mixed part 70 can be placed on and in contact with from 0.1 to 99.9% of the external surface of the bridge part 62 between the first terminal end 64 and the second terminal end 66 and be considered as "partially surrounding" the respective deck part 62.
In embodiments in which the second part 72 is not present, one of the at least one mixed part 70 completely surrounds the length of a respective element of the bridge parts 62 of the respective first terminal end 64 to the second terminal end 66 (i.e., encompasses more than 99.9% of the length of the bridge portion 62 from the respective first terminal end 64 to the second terminal end 66). Collectively, the at least one mixed part 70 and the optional second part 72 may alternatively be hereinafter collectively designated as a covering part which thereby surrounds each of the at least one bridge part 62 of the respective first terminal end 64 at the second terminal end 66.
The bridge part 62, as we will see in more detail below as regards the associated method of forming the optical connector 30, is formed by hardening a first composition having a first refractive index (RI ¹ ). The first composition is a curable composition and can be selected based at least on the first desired refractive index and other factors, e.g. ex. the desired hardening mechanism, as described below. The at least one mixed part 70, which will also be discussed further below, is formed by curing a mixture of the first composition and a second composition. The optional second part 72, as we will see below, is formed by hardening a part of the second composition which is not mixed with the first composition. The second composition has a second refractive index (RI ² ), and the at least one mixed part 70 has a third refractive index (RI ³ ) before hardening.
CH 710 969 B1 RII ³ generally comes from an average of the mixture of RI ¹ (of the first composition) and RI ² (of the second composition) and RI ¹ , RI ² and RI ³ are different from one of the other. In the present invention, the first and second compositions are selected so that RI ¹ > RI ² and the refractive index RI ³ of the mixture is therefore between RI ² and RI ¹ [i.e., RI ¹ > RI ³ > RI ² ).
In particular, the refractive index is generally a function not only of the substitution in the particular composition, but also of a crosslinking density of the cured product. To this end, the refractive index of the hardened bridge part 62 is generally greater than RI ¹ or higher than the refractive index of the first composition used to form the hardened bridge part 62. However, a refractive index gradient of each composition is generally maintained before and after curing. In other words, the hardened part of the bridge part 62 can have a refractive index RI ¹ , and the hardened part of the at least one mixed part 70 can have a refractive index RI ³ , and the hardened part of the second part 72 may have a refractive index of RI ² , but RI ¹ and RI ² and RI ³ are different from each other, just like RI ¹ and RI ² and RI ³ are different from each other. For example, the first composition has the refractive index RI ¹ , the hardened bridge part 62 formed from the first composition has the refractive index RI ¹ , where RI ¹ > RI ¹ due to the crosslinking density increased in the hardened bridge portion 62 compared to the first composition. Likewise, the second composition has the refractive index RI ² , the hardened second part 72 formed from the second composition has the refractive index RI ² , where RI ² > RI ² due to the increased crosslinking density in the second layer compared to the second composition. Similarly, the mixture of the first composition and of the second composition forming the unhardened mixed part has the refractive index RI ² and the hardened mixed part 70 has the refractive index RI ³ , where RI ³ > RI ³ in due to the increased crosslinking density in the cured mixed part 70 compared to the mixture of the first composition and the second composition which form the uncured mixed part. To this end, when RI ¹ > RI ³ > RI ² , then RI ¹ > RI ³ > RI ² . The ratio of RI ¹ / RI ¹ may be identical to or different from the ratio of RI ² / RI ² and may be the same as or different from the ratio of RI ³ / RI ³ .
In some embodiments, the first and second compositions each include a cationic polymerizable material including at least one cationic polymerizable group. Cationic polymerizable materials are typically curable by exposure to active energy rays using a cationic reaction mechanism. The cationic polymerizable group can be a neutral fragment. In other words, the term "cationic" modifies "polymerizable" rather than "group". The cationic polymerizable group can be located at any position (s) of the cationic polymerizable material. For example, the cationic polymerizable group may be pendant to or a substituent of the polymerizable cationic compound. The at least one cationic polymerizable group referred to herein simply as "the cationic polymerizable group" which, although singular, encompasses embodiments in which the cationic polymerizable group includes more than one cationic polymerizable group, for example, two or more cationic polymerizable groups. Typically, the cationic polymerizable material includes two or more cationic polymerizable groups, which are independently selected.
In certain embodiments, the cationic polymerizable group comprises a heterocyclic functional group, defined as a cyclic organic functional group, including at least one heteroatom, such as S, N, O and P; alternatively S, N and / or O. For example, heterocyclic groups include, but are not limited to, lactone groups, lactam groups, cyclic ethers and cyclic amines. The lactone groups are generally cyclic esters and can be chosen, for example, from an acetolactone, a propiolactone, a butyrolactone and a valerolactone. The lactam groups are generally cyclic amides and can be chosen, for example, from a ß-lactam, a γ-lactam, a δ-lactam and an ε-lactam. Specific examples of cyclic ethers include oxirane, oxetane, tetrahydrofuran and dioxepane (eg 1,3-dioxepane). Additional examples of heterocyclic functional groups include thietane and oxazoline. In particular, the heterocyclic functional groups described above can also exist in the form of monomers. However, in the context of the cationic polymerizable group, the heterocyclic functional groups set out above are substituents of a larger molecule and not of separate monomers. In addition, these groups can be linked or connected to the cationic polymerizable material using a divalent linking group.
In the other embodiments, the cationic polymerizable group can comprise a cationic polymerizable group other than a heterocyclic functional group. For example, the cationic polymerizable group can alternatively be chosen from an ethylenically unsaturated group, such as a vinyl, a vinyl ether, a divinyl ether, a vinyl ester, a diene, a tertiary vinyl, a styrene or a group. derived from styrene.
Combinations of different heterocyclic functional groups, or combinations of canonical polymerizable groups other than heterocyclic functional groups, or combinations of heterocyclic functional groups and cationic polymerizable groups other than heterocyclic functional groups may be included in the polymerizable material. cationic.
In certain embodiments where the cationic polymerizable material is organic, the first and / or second compositions can independently comprise an olefinic or polyolefinic material. In the other embodiments, the first and / or second compositions comprise an epoxy-functional organic material, such as an epoxy resin. Specific examples of epoxy resins include bisphenol-type epoxy resins, such as bisphenol A, bisphenol F, bisphenol AD, bisphenol S and hydrogenated epoxy resins
CH 710 969 B1 of bisphenol A type; a naphthalene type epoxy resin; an epoxy resin of the phenol-novolac type; a biphenyl epoxy resin; a glycidylamine type epoxy resin; an alicyclic type epoxy resin; or an epoxy resin of the dicyciopentadiene type. These epoxy resins can be used in combinations of two or more in each of the first and / or second compositions. In addition, alternatively, the first and / or second compositions can independently comprise a polyacrylic, a polyamide, a polyester, etc. or another organic polymeric material including the cationic polymerizable group. In these embodiments, the first and / or second compositions independently comprise organic compositions. "Organic material", as used herein, is distinguished from a silicone material, the silicone materials having a backbone comprising siloxane bonds (Si-O-Si) and the organic materials having a carbon-based backbone and being devoid of siloxane bonds.
In other embodiments, to increase the miscibility, the first and second compositions each independently comprise a silicone composition. If desired, the first composition can comprise a silicone composition and the second composition can comprise an organic composition and vice versa. A person skilled in the art can easily determine the refractive index of a composition and determine the miscibility between two compositions.
When the first and / or second compositions comprise silicone compositions, the first and / or second compositions comprise a silicone material. The silicone composition and the silicone material include organopolysiloxane macromolecules, where each macromolecule may independently be linear or branched. The silicone material can comprise any combination of siloxane units, i.e., the silicone material comprises any combination of R3SÌO1 / 2 units, i.e., M units , units R ₂ SiO _2/2, ie d., D units, units of RSiO _3/2, ie d., T units and SiO _4/2 units, c. ie, Q units, where R is generally independently selected from a substituted or unsubstituted hydrocarbyl group or a cationic polymerizable group. For example, R can be aliphatic, aromatic, cyclic, alicyclic, etc. In addition, R can include ethylenic unsaturation. By "substituted" is meant that one or more hydrogen atoms of the hydrocarbyl may be replaced by atoms other than hydrogen (eg a halogen atom, such as chlorine, fluorine, bromine, etc.), or a carbon atom in the chain of R can be replaced by a non-carbon atom, i.e., R can include one or more heteroatoms in the chain, such as oxygen, sulfur, nitrogen, etc .: R typically has from 1 to 10 carbon atoms. For example, R can have from 1 to 6 carbon atoms when aliphatic or from 6 to 10 carbon atoms when aromatic. Substituted or unsubstituted hydrocarbyl groups containing at least 3 carbon atoms may have a branched or unbranched structure. Examples of the hydrocarbyl groups represented by R include, but are not limited to, alkyls, such as methyl, ethyl, propyl, butyl, hexyl, heptyl, octyl, nonyl, decyl and isomers of these groups; alkenyls, such as vinyl, allyl and hexenyl; cycloalkyls, such as cyclopentyl, cyclohexyl and methylcyclohexyl; aryls, such as phenyl and naphthyl; alkaryls, such as tolyl and xylyl; and aralkyls, such as benzyl and phenethyl. Examples of halogen-substituted hydrocarbyl groups represented by R are illustrated by 3,3,3-trifluoropropyl, 3-chloropropyl, chlorophenyl, dichlorophenyl, 2,2,2-trifluoroethyl, 2,2,3,3-tetrafluoropropyl and 2 , 2,3,3,4,4,5,5-octafluoropentyl. Examples of the cationic polymerizable group represented by R are defined above.
In embodiments in which the silicone material is resinous, the silicone material can comprise a DT resin, an MT resin, an MDT resin, a DTQ resin, a MTQ resin, an MDTQ resin, a DQ resin , an MQ resin, a DTQ resin, an MTQ resin or an MDQ resin. Different resin combinations may be present in the silicone material. In addition, the silicone material may include a resin in combination with a polymer.
In a specific embodiment, the silicone material comprises or consists of an organopolysiloxane resin. The organopolysiloxane resin can be represented by the following unitary siloxane formula: (R ¹ R ² R ³ SiOi / 2) a (R ⁴ R ⁵ SiO2 / 2) _b (R ⁶ SiO _3/2 ) _c (SiO ₄ / ₂ ) d, where R ¹ , R ² , R ³ , R ⁴ , R ⁵ , and R ⁶ are selected independently of R, which is defined above; a + b + c + d = 1; “A” on average satisfies the following condition: 0 <a <0.4; “B” on average satisfies the following condition: 0 <b <1; “C” on average satisfies the following condition: 0 <c <1: “d” on average satisfies the following condition; 0 <d <0.4; “B” and “c” are linked by the following condition: 0.01 <b / c <0.3. Indices a, b, c and d denote an average number of moles of each siloxane unit. In other words, these indices represent an average mol% or a share of each siloxane unit in a molecule of the organopolysiloxane resin. Since R ^1-6 are selected independently of R, the formula for the above siloxane unit can be rewritten as follows:
(R ₃ SiO / 2) _a (R 2 SiO _{2/2) b} (RSiO _{3/2) c} (SiO _{4/2) d,} wherein R is independently selected and defined above, and are ad defined above.
Typically, in a molecule of the organopolysiloxane resin, siloxane units including a cationic polymerizable group constitute from 2 to 50 mol% of the totality of the siloxane units. Additionally, in these embodiments, at least 15 mole percent of all organic groups bonded to silicon include univalent aromatic hydrocarbon groups with 6-10 carbon atoms (eg, aryl groups).
The organopolysiloxane resin contains (R ⁴ R ⁵ SiO2 / 2) and (R ⁶ SiO3 / ₂ ) as essential units. However, the organopolysiloxane can additionally comprise structural units (R ¹ R ² R ³ SiOi / ₂ ) and (SiO _4/2 ). In other words, the organopolysiloxane resin containing epoxy can be composed of units indicated in the following formulas:
CH 710 969 B1 (R ⁴ R ⁵ SiO2 / 2) b (R ⁶ SiO3 / 2) c;
(R ¹ R ² R ³ SiO1 / 2) a (R ⁴ R ⁵ SiO2 / 2) _b (R ⁶ SiO3 / 2) c; (R ⁴ R ^s SiO2Z2) b (R ⁶ SiO3 / 2) c (SiO4Z2) d; or ((R ^l R ² R ³ SiO, / 2) a (R ⁴ R ⁵ SiO2 / ₂ ) _b (R ⁶ SiO3 / 2) _c (SiO4 / ₂ ) d.
If the content of the units (R ¹ R ² R ³ SiOi / 2) is too high, the molecular weight of the organopolysiloxane resin is reduced, and the following condition occurs: 0 <a <0.4. If the units (SiO4 / 2) are introduced under these conditions, a cured product of the organopolysiloxane resin may become undesirably hard and brittle. Therefore, in some embodiments, the following condition is satisfied: 0 <d <0.4; alternatively 0 <d <0.2; alternatively d = 0, the molar ratio b / c of the essential structural units (R ⁴ R ³ SiO2 / ₂ ) and (R ⁶ SiO3 / 2) should be 0.01 to 0.3, alternatively 0 , 01 to 0.25, alternatively from 0.02 to 0.25. Since the organopolysiloxane resin contains (R ⁴ R ⁵ SiO2 / ₂₎ and (R ⁶ SiO _3/2) as essential units, the molecular structure may vary mainly between branched and three-dimensional crosslinked.
The refractive index of the first and second compositions, when the first and second compositions each comprise the organopolysiloxane resin, can be selectively modified by changing the R of the respective organopolysiloxane resin. For example, when a majority of R in the organopolysiloxane resin are univalent aliphatic hydrocarbon groups, such as methyl groups, the refractive index of the organopolysiloxane resin may be less than 1.5. Furthermore, if a majority of R in the organopolysiloxane resin consists of univalent aromatic hydrocarbon groups, for example phenyl groups, the refractive index may be greater than 1.5. This value can be easily controlled by substitution of the organopolysiloxane resin, or by addition of additional components in the first and / or second compositions, as described below. Therefore, in some embodiments, the first composition comprises an organopolysiloxane resin including univalent aromatic hydrocarbon groups, while the second composition comprises an organopolysiloxane resin including univalent aliphatic hydrocarbon groups.
In various embodiments of the organopolysiloxane resin, the siloxane units having a cationic polymerizable group constitute from 2 to 70, alternatively from 10 to 40, alternatively from 15 to 40, molar percent of all siloxane units. If these siloxane units are present in the organopolysiloxane resin in an amount of less than 2 mol%, this will lead to a decrease in a degree of crosslinking during hardening, which decreases the hardness of the hardened product formed from them. this. If, on the other hand, the content of these siloxane units exceeds 70 mol% in the organopolysiloxane resin, the cured product may have reduced visible light transmission, low heat resistance and increased brittleness. Generally, the cationic polymerizable groups are not directly bonded to the silicon atoms of the organopolysiloxane resin. Generally, cationic polymerizable groups are rather linked to silicon atoms through a bivalent linking group, such as a hydrocarbylene, heterohydrocarbylene or organoheterylene linking group.
For example, when the cationic polymerizable groups are cyclic ether groups, for example epoxy groups, specific examples of cationic polymerizable groups suitable for the organopolysiloxane resin are set out immediately below:
Propyl 3- (glycidoxy) group;
—Ch ₂ - ch ₂ - ch ₂ - O- ch ₂ - ch-ch ₂ 'O
CH 710 969 B1
Propyl 2- (glycidoxycarbonyl) group:
II
CH2-ÇH-CO-CH2-CH-CH ₂ ch ₃
2- (3,4-epoxycyclohexyl) group of ethyl:
O ch ₂ -ch ₂
; and
Propyl 2- (4-methyl-3,4-epoxycycIohexyIe) group:
O ch ₂ -ch ₂ · ch ₃
ch ₃ [0048] Other examples of cyclic ether groups suitable for the cationic polymerizable group include the following: 2-glycidoxyethyl, 4-glycidoxybutyl groups or similar glycidoxyalkyl groups; 3 (3,4-epoxycyclohexyl) propyl groups or similar 3,4-epoxycyclohexylalkyl groups; 4-oxiranylbutyl, 8-oxiranyloctyl or similar oxiranylalkyl groups. In these embodiments, the cationic polymerizable material can be designated as an epoxy-functional silicone material.
Specific examples of cationic polymerizable groups other than the epoxy groups illustrated above include, but are not limited to the following groups (with the far left portion representing the bond connecting the particular cationic polymerizable group to the resin d organopolysiloxane):
O Specific examples of the organopolysiloxane resin when the cationic polymerizable groups are cyclic ether groups, for example epoxy groups, include organopolysiloxane resins comprising or consisting of the following sets of siloxane units: units (me ₂ SiO _2/2), (PhSiO _3/2) and (E ¹ SiO3 / 2); (Me3SiOi / 2), (Me2SiO3 / 2), (PhSiO3 / 2) and (E ¹ SiO3 / ₂ ) units; (Me ₂ SiO _2/2 ), (PhSiO _3/2 ), (E ¹ SiO3 / 2) and (SiO4 / 2) units; (Me2SiO2 / 2), (PhSiO3 / 2), (MeSiO3 / 2) and (E ¹ SiO3 / ₂ ) units; units (Ph ₂ SiO _2/2), (PhSiO _3/2) and (E ¹ SiO3 / 2); (MePhSiO2 / 2), (PhSiO3 / 2) and (E ¹ SiO3 / ₂ ) units; units (Me ₂ SiO _2/2), (PhSiO _3/2) and (E ² SiO3 / 2); (Me2SiO2 / 2), (PhSiO3 / 2) and (EE ³ SiO3 / 2) units; units (Me ₂ SiO _2/2), (PhSiO _3/2) and ⁽⁴ E SiO3 / 2); (MeViSiO2 / 2), (PhSiO3 / 2) and (E ³ SiO3 / 2) units; units (Me ₂ SiO _2/2), (PhSiO _3/2), (MeSiO _3/2) and ⁽³ E SiO3 / 2); (Ph2SiO2 / 2), (PhSiO3 / 2) and (E ³ SiO3 / 2) units; (Me ₂ SiO _2/2 ), (Ph ₂ SiO _2/2 ) and (E ¹ SiO3 / 2) units; (Me2SiO2 / 2), (Ph2SiO2 / 2) and (E ³ SiO3 / 2) units; (Me ₂ ViSiO _1/2 ), (Me ₂ SiO _2/2 ), (PhSiO _3/2 ) and (E ¹ SiO3 / 2) units; (Me3SiO1 / 2), (Ph2SiO2 / 2), (PhSiO3 / 2) and (E ¹ SiO3 / ₂ ) units; (Me ₃ SiO _1/2 ), (Me ₂ SiO _2/2 ), (PhSiO _3/2 ) and (E ³ SiO3 / 2) units; (Me2SiO2 / 2), (PhSiO3 / 2), (E ³ SiO3 / 2) and (SiO ₂ ) units; units (Me ₂ SiO _2/2), (Ph ₂ SiO _2/2), (E ¹ SiO3 / 2) and (SiO2); (Me3SiOi / 2), (Me2SiO2 / 2), (PhSiO3 / 2), (E ¹ SiO3 / ₂ ) and (SiO ₂ ) units; and units (Me ₃ SiO _1/2), (Me ₂ SiO _2/2), (PhSiO _3/2), (E ³ SiO _3/2) and (SiO _2); where Me denotes a methyl group, Vi denotes a vinyl group, Ph denotes a phenyl group, E ¹ denotes a 3- (glycidoxy) group of propyl, E ² denotes a 2- (glycidoxycarbonyl) group of propyl, E ³ denotes a group 2- (3,4epoxycyclohexyl) ethyl and E ⁴ denotes a 2- (4-methyl-3,4-epoxycyclohexyl) group of propyl. The same designations apply to the following description herein. It is expected that any of the univalent hydrocarbon substituents illustrated in the above organopolysiloxane resins (eg, Me, Ph and Vi) may be replaced by other univalent hydrocarbon substituents. For example, an ethyl or other substituted or unsubstituted hydrocarbyl group can be used in place of any of the above methyl, phenyl or vinyl groups. In addition, cationic polymerizable groups other than E ¹ -E ⁴ can be used instead of or in addition to E ¹ -E ⁴ .
CH 710 969 B1
However, the organopolysiloxane resin species identified above are particularly desirable because of their refractive index values and physical properties.
The organopolysiloxane resin may have certain alkoxy residual groups bonded to silicon and / or hydroxyl groups bonded to silicon (i.e., silanol groups) from its preparation. The content of these groups may depend on the manufacturing process and conditions. These substituents can affect the storage stability of the organopolysiloxane resin and decrease the thermal stability of the cured product formed from the organopolysiloxane resin. Therefore, in some embodiments, it is desirable to limit the formation of these groups. . For example, the amount of alkoxy groups bonded to silicon and hydroxyl groups bonded to silicon can be reduced by heating the organopolysiloxane resin in the presence of a minute amount of potassium hydroxide, which causes a dehydration reaction and condensation or a de-alcoholation and condensation reaction. It is recommended that the content of these substituents is not more than 2 mol% and preferably not more than 1 mol% of all the substituents on the silicon atoms.
Although there is no particular restriction with regard to the number average molecular weight (M _n ) of the organopolysiloxane resin, the organopolysiloxane resin has, in certain embodiments, an Mn between 103 and 106 Daltons.
In some embodiments, the first and / or second compositions may not, alternatively may, further comprise a diluent component. In some embodiments, the diluent component includes a silane compound having a single (unique) cationic polymerizable group bonded to silicon.
The single cationic polymerizable group bonded to silicon can be any of the cationic polymerizable groups described above.
The silane compound generally has a dynamic viscosity of less than 1000, alternatively less than 500, alternatively less than 100, alternatively less than 50, alternatively less than 25, so alternative of less than 10, centipoise (cP) at 25 degrees Celsius (° C). Dynamic viscosity can be measured with a Brookfield viscometer, an Ubbelohde tube, cone / plate rheology or other devices and methods. Although the values may vary slightly depending on the instrument / device used, these values are generally maintained regardless of the type of measurement. In these embodiments, the silane compound has a boiling point of at least 25, alternatively of at least 50, alternatively of at least 75, alternatively of at least 80, so alternative of at least 85, alternatively of at least 90, ° C at a pressure of 133.32 Pascals (1 millimeter of mercury (mm Hg)). For example, in certain embodiments, the silane compound has a boiling temperature of 80 to 120 ° C, alternatively 90 to 110 ° C at a pressure of 133.32 Pascals (1 mm Hg).
In certain embodiments, the silane compound of the diluent component is free from any hydrolyzable group bonded to silicon other than potentially the cationic polymerizable group. For example, some silicon-bonded hydrolyzable groups, such as silicon-bonded halogen atoms, react with water to form silanol (SiOH) groups, in which the silicon-halogen bond has been cleaved. Other hydrolyzable groups bound to silicon, such as a carboxylic ester, can hydrolyse without cleaving any bond to silicon. To this end, in certain embodiments, the silane compound is free from any hydrolyzable group bonded to silicon which can hydrolyze to form silanol groups. In other embodiments, the cationic polymerizable group of the silane compound is not hydrolyzable so that the silane compound is completely free of any hydrolyzable group bonded to silicon. In these embodiments, the cationic polymerizable group is not hydrolyzable, for example the cationic polymerizable group is a cyclic ether. Specific examples of hydrolyzable groups include the following silicon bonded groups: a halide group, an alkoxy group, an alkylamino group, a carboxyl group, an alkyliminoxy group, an alkenyloxy group and an N-alkylamido group. For example, some conventional silane compounds may have, in addition to having more than one cationic polymerizable group, an alkoxy group bonded to silicon. These silicon-bonded alkoxy groups of these conventional silane compounds can hydrolyse and condense, forming siloxane bonds and increased crosslink density of the cured product. In contrast, the silane compound is generally used to reduce a crosslinking density of the cured product, and thus these hydrolyzable groups are, in some embodiments, undesirable.
In various embodiments, the silane compound of the diluent component has the following general formula:
R
R-Si-X
CH 710 969 B1 where R is independently selected and defined above. Y is the cationic polymerizable group, and X is chosen from R and SiR ₃ .
In certain embodiments, X is R such that the silane compound comprises a monosilane compound. In these embodiments, the silane compound has the general formula YSiR ₃ , where Y and R are defined above. When Y is independently chosen from E ¹ -E ⁴ above, the silane compound can be rewritten as, for example, E ¹ SiR3, E ² SiR3, E ³ SiR3 and E ⁴ SiR3. Of E ¹ -E ⁴ , E ³ is the most typical.
In the other embodiments, X is SiR ₃ such that the silane compound comprises a disilane compound. In these embodiments, the single cationic polymerizable group can be bonded to any of the silicon atoms of the disilane, the silicon atoms of which are typically directly bonded to each other. Although R is independently selected from substituted and unsubstituted hydrocarbyl groups, R is more typically selected from alkyl groups and aryl groups to control the refractive index.
Specific examples of the silane compound and their preparation methods are described in the co-pending PCT international patent application number PCT / US14 / 038 149 (DC 11 701 PCT2), filed on May 15, 2014.
The silane compound can effectively dissolve the cationic polymerizable material, for example the organopolysiloxane resin, thus avoiding the need for another solvent. In certain embodiments, the first and / or second compositions are devoid of a solvent other than the silane compound. The silane compound also reduces the refractive index of the first and / or second compositions, if present therein, and the relative amount of the silane compound used can be varied to selectively control the refractive index of the first and / or second compositions. For example, the first composition may use the silane compound in an amount less than the second composition, thus giving the second composition a lower refractive index than the first composition, while remaining otherwise equal (for example organopolysiloxane resin particular used).
The diluent component generally comprises the silane compound in an amount based on the desired refractive index and other physical properties of the first and / or second compositions. For example, in certain embodiments, the component diluent comprises the silane compound in an amount sufficient to provide at least 3, alternatively at least 5, alternatively at least 10, alternatively at least 15, alternatively to minus 20, alternatively at least 25, alternatively at least 30, percent by weight of the silane compound based on the total weight of the second composition. The silane compound is generally present in a smaller amount in the first composition than in the second composition, if it is used in both.
The diluent component cannot, alternatively may, include compounds or components in addition to the silane compound. For example, the diluent component may include a diluent compound other than the silane compound and in addition to it. The diluent compound may differ from the silane compound in various respects. For example, the diluent compound may have more than one cationic polymerizable group. Alternatively, the diluent compound may have a single cationic polymerizable group, but may be free of silicone. The diluent component can comprise more than one diluent compound, i.e., the diluent component can comprise any combination of diluent compounds. The diluent compound can be aromatic, alicyclic, aliphatic, etc.
Among the specific examples of suitable diluent aromatic compounds for the diluent component, let us mention polyglycidyl ethers of polyhydric phenols each containing at least one aromatic ring, or alkylene oxide adducts of phenols such as the glycidic ethers of bisphenol A and of bisphenol F, or compounds obtained by additional addition of alkylene oxides to bisphenol A and bisphenol F; and novolak epoxy resins.
Among the specific examples of the suitable diluting alicyclic compounds for the diluting component, let us cite polyglycidyl ethers of polyhydric alcohols each containing at least one alicyclic ring; and compounds containing cyclopentene oxide or cyclohexene oxide obtained by epoxidation of compounds containing a cyclohexene ring or a cyclopentene ring with oxidants. Examples include a hydrogenated glycidyl bisphenol A ether, 2- (3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy) cyclohexane-methadioxane, bis (3,4-epoxycyciohexylmethyl) adipate, vinylcyclohexene dioxide, 4-vinylepoxycyclohexane, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, 3,4epoxy-6-methylcyclohexylcarboxylate, dicyclopentadienediepoxide, ethylene glycol di (3,4-epoxycyclohexylmethyl) ethexyhexylhexylhexylhexylhexylhexylhexylhexylhexylhexylhexylhexylhexylhexylhexylhexylhexylhexylethylhexylhexylethylhexylhexylhexylethylhexylhexylethylphenyl epoxyhexylhexylhexylhexylethylhephthalophthalate)
Specific examples of suitable diluent aliphatic compounds for the diluent component include polyglycidyl ethers of aliphatic polyhydric alcohols and alkyleneoxide adducts of aliphatic polyhydric alcohols; polyglycidyl esters of aliphatic long chain polybasic acid, homopolymers synthesized by vinyl polymerization of glycidyl acrylate or glycidyl methacrylate and copolymers synthesized by vinyl polymerization of glycidyl acrylate and another vinyl polymer. Representative compounds include glycidic ethers of polyhydric alcohols, such as 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, triglycidyl glycerin ethers, triglycidyl ethers of trimethylolpropane, tetraglycidyl ethers of sorbitol, hexaglycidyl ethers, hexaglycidyl ethers diglycidyl ethers of polyethylene glycol, diglycidyl ethers of polypropylene glycol, polyglycidyl ethers of polyether polyols obtained by adding one, two or more kinds of alkylene oxides with an aliphatic polyhydric alcohol such as propylene glycol, propane trimethylol or glycerine and diglycidyl esters of long chain aliphatic dibasic acids. In addition,
CH 710 969 B1 monoglycidyl ethers of higher aliphatic alcohols, phenol, cresol, butyphenol, monoglycidyl ethers of polyether alcohols obtained by adding alkylene oxide, glycidyl esters of higher aliphatic acids, oil epoxidized soybeans, octyl epoxystearate, butyl epoxystearate, epoxidized linseed oil, epoxidized polybutadiene, and the like are illustrated.
Additional examples of suitable diluent compounds for the diluent component include oxetane compounds, such as trimethylene oxide, 3,3-dimethyl oxetane and 3,3-dichloromethyl oxetane; trioxanes, such as tetrahydrofuran and 2,3-dimethyltetrahydrofuran; cyclic ether compounds, for example, 1,3-dioxolane and 1,3,6trioxacyclooctane; cyclic lactone compounds, such as propiolactone, butyrolactone and caprolactone; thiirane compounds, such as ethylene sulfide; thiethane compounds, such as trimethylene sulfide and 3,3-dimethylthiethane; cyclic thioether compounds such as tetrahydrothiophene derivatives; spiro ortho ester compounds obtained by a reaction of an epoxy and lactone compound; and vinyl ether compounds such as ethylene glycol divinyl ether, alkylvinyl ether, 3,4-dihydropyran-2-methyl 3,4-dihydropyrane-2-methyl (3,4-dihydropyrane-2-methyl (3,4- dihydropyran-2-carboxylate) and triethylene glycol divinyl ether.
If present, the diluent component generally includes the diluent compound in an amount sufficient to provide from more than 0 to 30, alternatively more than 0 to 10, alternatively from 1 to 5, percent by weight of the diluent compound as a function of the total weight of the first composition or the second composition, respectively. These values generally reflect any cationic polymerizable diluent compound other than the silane compound in the diluent component, i.e. when a combination of different diluent compounds is used, the above values represent their collective amounts. In some embodiments, the diluent component includes the silane compound and the diluent compound.
In some embodiments, each of the first and second compositions further comprises a catalyst. The catalyst of the first composition may be identical to or different from the catalyst of the second composition. Each catalyst is independently effective in improving the hardening of the respective composition. For example, when the first and second compositions are curable by exposure to active energy rays, the catalyst can be called a photocatalyst. However, catalysts other than photocatalysts can be used, for example when the first and / or second compositions are cured after exposure to heat as opposed to active energy rays. The photocatalyst can alternatively be designated a photopolymerization initiator and is generally used for initiating photopolymerization of the cationic polymerizable material and of the diluent component. In some embodiments, the first and second compositions independently comprise (A) an organopolysiloxane resin; and (B) a catalyst. The organopolysiloxane resin is described above. The catalyst can include any suitable catalyst for such polymerization. Examples of catalysts can include sulfonium salts, iodinium salts, selenonium salts, phosphonium salts, diazonium salts, para-toluene sulfonate, trichloromethyl substituted triazine and substituted benzene trichloromethyl. Additional catalysts include acid generators, which are known in the art. The catalyst can increase the cure rate of the composition, decrease the time to cure, increase the degree of crosslinking of the composition, increase the crosslink density of the cured product, or a combination of any two or more. two factors of these. In general, the catalyst increases at least the cure rate of the composition.
The sulfonium salts suitable for the catalyst can be expressed by the following formula: R ⁷ 3S ⁺ X ~, where R ⁷ can denote a methyl group, an ethyl group, a propyl group, a butyl group or an alkyl group similar with 1 to 6 carbon atoms; a phenyl group, a naphthyl group, a biphenyl group, a tolyl group, a propylphenyl group, a decylphenyl group, a dodecylphenyl group or a similar aryl or substituted aryl group having 6 to 24 carbon atoms. In the above formula, X “represents SbF6“, AsF6 “, PF6“, BF4 “, B (C6F5) 4“, HSO4 ^_ , CIO4 ^_ , CF3S03 “or non-basic non-nucleophilic anions. The iodonium salts can be represented by the following formula: R ⁷ 21 ⁺ X ^_ , where R ⁷ is the same as X “defined above. The selenonium salt can be represented by the following formula: R ⁷ 31 ⁺ X ^_ , where R ⁷ , X “are the same as defined above. The phosphonium salt can be represented by the following formula: R ⁷ 4P ⁺ X ^_ , where R ⁷ , X “are the same as defined above. The diazonium salt can be represented by the following formula: R ⁷ N2 ⁺ X ^_ , where R ⁷ and X “are the same as defined above. Para-toluene sulfonate can be represented by the following formula: CH3C ₆ H ₄ SO ₃ R ⁸ , in which R ⁸ is an organic group which contains an electron attracting group, such as a benzoylphenylmethyl group or a phthalimide group. The trichloromethyl-substituted triazine can be represented by the following formula: [CCI3] 2C3N3R ⁹ , in which R ⁹ is a phenyl group, substituted or unsubstituted phenylethyl group, phenylethynyl group, substituted or unsubstituted furanylethynyl group or an attractor group similar electrons. Benzene with trichloromethyl substituents can be represented by the following formula: CCI3C ₆ H ₃ R ⁷ R ¹⁰ , in which R ⁷ is the same as that defined above, R ¹⁰ is a halogen group, a substituted alkyl group halogen or a similar group containing halogens.
[0071] Specific examples of suitable catalysts for the first and / or second compositions include tetrafluoroborate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium triturate triphenylsulfonium, tri (ptolylejsulfonium hexafluorophosphate, p-tert-butylphenyl diphenylsulfonium hexafluoroantimonate, tetrafluoroborate, triphenylsulfonium diphenyliodonium hexafluoroantimonate , p-tert-butylphenyl biphenyliodonium hexafluoroantimonate, di (p-tert-butylphenyl) iodonium hexafluoroantimonate, bis (dodecylphenyl) iodonium hexafluoroantimonate, tetrafluoro12
CH 710 969 B1 triphenylsulfonium borate, tetraphenylphosphonium tetrafluoroborate, tetraphenylphosphonium hexafluoroantimonate, p-chlorophenyldiazonium tetrafluoroborate, benzoylphenyl para-toluenesulfonate, bis (trichloromethyl) triethyl chloride bis (trichloromethyl) phenyl trichloromethyl)
The catalyst can comprise two or more different species, optionally in the presence of a carrier solvent.
The catalyst can be present in the first and second compositions in quantities varying independently. Generally, the catalyst is present in sufficient amount to initiate polymerization and hardening upon exposure to active energy rays (i.e., high energy rays), such as ultraviolet rays. In certain embodiments, the catalyst is used in each of the first and second compositions in an amount ranging from more than 0 to 5, alternatively between 0.1 and 4, percent by weight depending on the total weight of the respective composition .
The first and / or second compositions can be free of solvent. In these embodiments, the diluent component generally solubilizes the cationic polymerizable material sufficiently to pour and coat by wet coating the first and second compositions. However, if desired, the first and / or second compositions can additionally comprise a solvent, for example an organic solvent. Solvent-free, as used herein with reference to the first and / or second compositions being solvent-free, means that all of the solvent, including any carrier solvent, may be present in the respective composition in a smaller amount to 5, in a variant less than 4, in a variant less than 3, in a variant less than 2, in a variant less than 1, in a variant less than 0.1, percent by weight depending on the total weight of the respective composition.
The solvent, if used, is generally chosen for its miscibility with the cationic polymerizable material and the diluent component. Typically, the solvent has a boiling temperature of 80 ° C to 200 ° C at atmospheric pressure, which allows the solvent to be easily removed by heat or other methods. Specific examples of solvents include isopropyl alcohol, tert-butanol alcohol, methyl ethyl ketone, methyl isobutyl ketone, toluene, xylene, mesitylene, chlorobenzene, ethylene glycol dimethyl ether, ethylene glycol ether, diethylene glycol dimethyl ether, ethoxy -2-propanolacetate, methoxy-2-propanolacetate, octamethylcyclotetrasiloxane, hexamethyldisiloxane, etc. Two or more solvents can be used in combination.
The first and / or second compositions can optionally and in addition include any other suitable component, such as a coupling agent, an antistatic agent, an ultraviolet absorber, a plasticizer, a leveling agent, a pigment, a catalyst, a catalyst inhibitor and so on. The catalyst inhibitor can operate to prevent or slow down the cure rate until the catalyst is activated (for example by removing or deactivating the inhibitor).
In certain embodiments, the first and second compositions are each in the form of a liquid having a dynamic viscosity of 20 to 10,000 mPa.s at 25 ° C. Dynamic viscosities can be measured with a Brookfield viscometer, an Ubbelohde tube, cone / plate rheology, or other devices and methods. Although the values may vary slightly depending on the instrument / device used, these values are generally maintained regardless of the type of measurement.
The optical connector 30 and the associated optical device 20 formed from the optical connector 30 can be formed by the method described below in FIGS. 2 to 7.
Referring first to FIG. 2, the method begins with the positioning of the first optical assembly 20 relative to the second optical assembly 40 so that there is a spacing 80 between the optical interface 26 and the waveguide interface 50. In this position preferably, at least one of the at least one optical element 22 is aligned with a corresponding element of the at least one optical element 42 passing through the space 80.
Then, as illustrated in FIG. 3, the method further comprises applying a first composition having a first refractive index (RI ¹ ) in the spacing 80 to form a first layer 94 so that the first layer 94 is in contact with the end terminal 24 of each of the at least one optical element 22 at the first optical interface 26 and so that the first layer 94 is in contact with the terminal end 48 of each of the at least one optical element 42 at the second optical interface 50.
In certain embodiments, the first layer 94 is applied to the first substrate 47 contained in the first and second optical assemblies 20, 40. As a variant, the first layer 94 is applied to an internal surface 91 of the housing 25 and / or on an internal surface 93 of the housing 45, or on the two internal surfaces 91 and 93, when the housing 25 is coupled to the housing 45.
The first composition, as described above, is a curable composition and can be chosen according to at least the first desired refractive index and other factors, p. ex. the desired hardening mechanism.
The first composition can be applied to the substrate 47 or to the internal surfaces 91 and 93, by means of various methods. For example, in some embodiments, the step of applying the first composition includes a wet coating process. Specific examples of wet coating processes
CH 710 969 B1 suitable for the process include dip coatings, centrifugal coating, flux coating, coated spray, roller coating, rotogravure coating, spraying, slot coating and combinations thereof.
Then, as illustrated in FIG. 4, the method further comprises applying a hardening condition to a target portion of the first layer 94, without applying the hardening condition to a non-target portion of the first layer, to form a contrast layer 96 including at least a hardened bridge part 62 and at least an uncured part 98. Each of the at least one hardened bridge portion 62 extends in the space 80 of the terminal end 24 of one of the at least one respective optical element 22 at the corresponding aligned terminal end 48 of one of the at least one respective optical elements 42. The method by which the first layer 94 is selectively cured, and therefore the curing condition used is determined by at least the first composition. For example, in some embodiments, the first composition and the first layer formed from the composition are curable by exposure to active energy rays, i.e., the first layer is selectively cured by selective irradiation of the first layer using rays of active energy. Active energy rays can include ultraviolet rays, electron beams, or other electromagnetic waves or radiation. Furthermore, the first layer can be thermally cured. In these embodiments, the first layer 94 is selectively cured by selectively heating the first layer 94, e.g. ex. by selectively heating the first layer with a heating element. Examples of suitable heating elements include inductive or resistive heating elements, infrared (IR) heat sources (e.g. IR lamps) and flame heat sources. An example of an inductive heating element is a radio frequency (RF) induction heating element.
Preferably, as illustrated in FIG. 4, the first layer 94 is cured by transmitting light of a first predetermined wavelength in the ultraviolet light range from the at least one optical element 22 through the respective terminal end 24 and into the target portion of the first composition comprising the first layer 94 for a period of time sufficient to induce changes in the refractive index in the target part of the first composition from RI ¹ to RI ¹ and form the at least one hardened bridge parts 62 so that each extends from the respective terminal end 24 of the respective element of the optical elements 22 of the first optical assembly 20 to the corresponding element of the respective optical elements 42 of the second optical assembly 40.
Then, as illustrated in FIG. 5, the method further comprises applying a second composition having a second refractive index (RI ² ) on the contrast layer 96 to form a second layer 102 and mixing at least part of the second layer 102 and at least a portion of the at least one uncured portion 98 of the contrast layer 96 to form at least one mixed portion 104 having a third refractive index (RI ³ ) in the contrast layer 96. After this mixing step, each of the at least one hardened bridge part 62 is at least partially surrounded by at least one of the at least one mixed part 104 of the first terminal end 64 respective to the second terminal end 66, but where the terminal ends 64, 66 are not covered by the second layer 102 or mixed part 104, as described above.
In some embodiments, part of the second layer 102 is not mixed with the uncured part 98 of the contrast layer 96 and remains an unmixed part (illustrated by the number 102 in Fig. 5 ). In these embodiments, a portion of the second layer 102 may partially surround one or more of the at least one bridge portions 62, where the second layer 102 and one of the at least one mixed portion 104 collectively entirely surround a respective member at least one deck parts 62.
Preferably, however, the entirety of the second composition is mixed with the at least one uncured portion 98 to form the mixed portion 104 (i.e., there is no second layer 102 present after mixing). In this preferred embodiment, each of the at least one hardened bridge part 62 is entirely surrounded by one of the at least one mixed part 104 of the first terminal end 64 respective to the second terminal end 66, but where the terminal ends 64, 66 are not covered by the mixed part 104, as described above.
The first and second compositions and the at least one mixed part 104 are different from each other. In addition, RI ¹ , RI ² and RI ³ are different from each other.
The second composition can be applied to the first layer 94 using various methods including those described above for the application of the first composition. For example, in certain embodiments, the step of applying the first composition to the first layer 94 includes a wet coating process. Specific examples of wet coating methods suitable for the method include dip coatings, centrifugal coating, flux coating, coated spray, roll coating, gravure coating, spraying, slit coating and combinations thereof.
Then, as illustrated in FIG. 6, the method further comprises applying a second hardening condition to harden the mixed part 104 and the second layer 102 possibly present to form a hardened mixed part 70 and an optional hardened second part 72, and thus form the connector. optics 30 and the first optical device 15 completed.
The process by which the second layer 102, when present, and at least one mixed portion 104 is selectively cured and thus the curing condition used, is determined by at least the first composition and the second composition.
CH 710 969 B1 For example, in certain embodiments, the first composition and the second composition used to form the second layer 102, if necessary, and the mixed part 104 can be hardened by exposure to active energy rays (i.e., the second layer 102, when present, and at least one mixed portion 104 are selectively cured by selective radiation from the first layer using rays of active energy). Active energy rays can include ultraviolet rays, electron beams, or other electromagnetic waves or radiation.
Alternatively, the second layer 102, when present, and at least one mixed portion 104 can be thermally cured. In these embodiments, the second layer 102, when present, and at least one mixed portion 104 are cured by selectively heating the second layer 102 and at least one mixed portion 104, e.g. ex. by selectively heating the second layer 102 and at least one mixed portion 104 with a heating element. Examples of suitable heating elements include inductive or resistive heating elements, infrared (IR) heat sources (e.g. IR lamps) and flame heat sources. An example of an inductive heater is a radiofrequency (RF) induction heater.
In certain embodiments, the second layer 102, if necessary, and at least one mixed part 104 are hardened by heating the layer 102 and part 104 to a temperature varying from 90 to 260 ° C.
In still other embodiments, a combination of curing methods can be used. Thus, for example, the second layer 102, if necessary, and at least one mixed portion 104 can be hardened both by exposure to active energy rays and by heating, as described above.
The resulting optical device 15, as illustrated in FIG. 6, is formed in which each of the hardened bridge parts 62 is surrounded by the hardened mixed part 70 and the second hardened part 72, if any, from the respective first terminal end 64 to the second terminal end 66, but where the ends terminals 64, 66 are not covered by the hardened mixed part 70 and the second hardened part 72 (i.e., between the terminal end 24 of one of the at least one optical element 22 of the first assembly optic 20 and the corresponding terminal end 48 of the respective element of the at least one optical element 42 of the second optical assembly 40). In the preferred embodiments, each of the hardened bridge parts 62 having an refractive index RI ¹ is surrounded by a hardened mixed part 70 having a refractive index RI ² from the respective first terminal end 64 to the second terminal end 66 , but where the terminal ends 64, 66 are not covered by the hardened mixed part 70. As a variant, in certain embodiments, each of the hardened bridge parts 62 having a refractive index RI ¹ is surrounded by a mixed hardened part 70 having a refractive index RI ² and a second hardened part 72 having a refractive index RI ³ from the respective first terminal end 64 to the second terminal end 66, but where the terminal ends 64, 66 are not covered by the hardened mixed part 70 and the hardened second part 72.
In yet other embodiments, at least one of the hardened bridge parts 62 having a refractive index RI ¹ is therefore surrounded by a hardened mixed part 70 having a refractive index RI ² of the first terminal end 64 respectively at the second terminal end 66, but where the terminal ends 64, 66 are not covered by the mixed part 104, and where the second layer 72 is present and surrounds a hardened mixed part 70 and does not cover the terminal ends 64 , 66 respectively.
In any of these embodiments, an optical connector 30 is formed in which each of the at least one bridge part 62 has a lower refractive index than the coating part which surrounds it (than this coating part comprises the hardened mixed part 70 or the combination of the hardened mixed part 70 and the second hardened part 72 as indicated above). In other words, there is a contrast in the refractive index between the bridge part 62 with a low refractive index and the coating part with a higher refractive index, and more precisely the hardened mixed part 70 with a higher refractive index. 70 and the optional hardened second part 72, which surrounds it. A person skilled in the art would appreciate that the contrast between the hardened bridge parts 62 with a lower refractive index and the hardened coating part with a higher refractive index, and more precisely the mixed hardened layer 70 with refractive index. higher and optional hardened second part 70, allows electromagnetic radiation (i.e., one or more electromagnetic waves) to be guided along the length of bridge parts 62 with minimal losses to the mixed layer 70 and the optional second layer 72. Thus, the present invention provides a more efficient optical connector 30 for propagating one or more electromagnetic waves between the first optical assembly 20 and the second optical assembly 40.
In addition, the precision alignment requirements for the optical connectors will be reduced as will the system misalignment tolerances using optical connectors 30 formed according to the method of the present invention, since the interface of the hardened bridge portion 62 will conform in size and shape to the size and shape of the respective terminal ends 24 or 48 of the optical elements 22, 42 to which it is aligned following the application of the first hardening condition to form the respective deck part 62. For example, the bridge part 62 will have a rounded section view at the terminal end 64 or 66 which corresponds in size and shape to the corresponding rounded shape of the terminal end 24 or 48 of the optical element 22 or 42. Likewise, the bridge part 62 will have a size and a square shape in transverse section at the terminal end 64 or 66 where the optical element 22 or 42 is made square at its respective terminal end 24 or 48. We also believe that this conformity between the end
CH 710 969 B1 terminal 64 or 66 respectively and the corresponding terminal end 24 or 48 minimizes losses by electromagnetic radiation at the interface between the respective optical element 22 or 42 and the bridge part 62.
In yet other embodiments, an optical connector 30 forms a hardened bridge portion 62A which extends between misaligned optical elements 22A and 42A, as illustrated in FIGS. 13 and 14. The process for forming the optical connector 30 and the optical assembly 15 follows the same general method as that described above with regard to FIGS. 2 to 6, except that in fig. 14 (with respect to FIG. 4), the light transmitted from the first predetermined wavelength bends so that it is located from the respective terminal end 24 of the first optical element 22A to the terminal end 48 of the second optical element 24A, thus the hardening of the hardened bridge part 62 is a slightly oblique direction relative to the length of the first optical element 22A and of the second optical element 42A.
In addition, a polishing will probably not be necessary because the terminal end 64 or 66 of each of the hardened bridge parts 62, such that the bridge part 62 will have roughness which will give better adhesion to the element. optics 22 or 42 respectively. Still further, concerns about fiber protrusions in certain optical systems having MV connections can be alleviated by the connection process of the present invention.
Likewise, the manufacturing process for forming the optical connectors 30 of the present invention is simple and reproducible for the coupling of a large variety of optical peripherals 20, 40 and 220 having similar optical elements 22, 42 or 222 or different, as described above.
In still other embodiments, a separate optical device 215 different from the first optical device 15 can be formed from the first optical device 15 having the optical connector 30 which is formed according to the above method. This additional process is illustrated in Figs. 7 to 9.
[0105] Referring first to FIG. 7, the method for forming a second optical device 215 begins by disconnecting the first optical assembly 20 from the formed optical connector 30 (and therefore from the second optical assembly 40) so that each of the at least one hardened bridge parts 62 remains in contact with the terminal end 48 of the respective element of at least one optical element 42 of the second optical assembly 40. This can be done in various ways, preferably by simply moving the first optical assembly 20 in a direction away from the second optical assembly 40, as indicated by arrow 190, or by moving the second optical assembly 40 in a direction away from the first optical assembly 20, as indicated by arrow 195. In this process, the housing 25 is uncoupled or otherwise disconnected from housing 45.
In these embodiments, the first optical assembly 20 and the second optical assembly 40 include different shapes of the optical elements 22 and 42, and the hardened bridge portion 62 adheres more strongly to the optical elements 42 than to the optical elements 22 and thus remain in contact with the optical elements 42 when the first optical assembly 20 is distant from the second optical assembly 30.
Then, as illustrated in FIG. 8, a third optical assembly 220 different from the first optical assembly 20 is provided.
The third optical assembly 220 has at least one optical element 222 with a terminal end 224 of each of the at least one optical elements 222 ending at a second optical interface 226. The third optical assembly 220 also includes a housing 225 and a coating 223 surrounding the optical elements 222. The optical element 222, similar to the optical element 22 or 42, refers to any device or material capable of guiding one or more electromagnetic waves (such as, for example, one or more light waves in the spectrum of ultraviolet light or one or more light waves in the spectrum of visible light) over its respective length. Suitable examples of optical elements which could include optical element 222 therefore include, but are not limited to, optical fibers, polymer waveguides, lenses, transmission modules, reception modules or transceivers ( modules including transmission and reception modules).
However, as we mentioned above, the third optical assembly 220, including these optical elements 222, is different from the first optical assembly 20 including the optical elements 22. Preferably, the number of optical elements 222 and the size and shape of these optical elements 222, in some embodiments, are similar to the number, size and shape of the optical elements 22 of the first optical assembly 30, although in some other embodiments the number, size or shape could be different. Likewise, the relative positioning of the at least one optical element 222 within the third optical assembly 220 may be identical to or different from the first optical assembly 30.
As also illustrated in FIG. 8, the optical connector 30 coupled to the second optical assembly 40 is positioned relative to the third optical assembly 220 along the third optical interface 226 so that the terminal end 224 of each of the at least one optical elements 222 of the third optical assembly 220 is adjacent to the terminal end 64 of a respective element of the at least one hardened bridge parts 62.
Then, as illustrated in FIG. 9, the third optical assembly 220 is moved to be brought into contact with the second optical assembly 40 so that the terminal end 224 of each of the at least one optical element 222 of the third optical assembly 220 is brought into contact with the end terminal 64 of a respective element of at least
CH 710 969 B1 one parts of bridge 62 hardened. In this way, a new optical device 215 comprising the third optical assembly 220 coupled to the second optical assembly 40 via the optical connector 30 is formed.
The method described in FIGS. 7 to 9 can thus be used to easily connect any two optical devices having optical elements positioned in the same way. The process described in figs. 7 to 9 also allows the second optical assembly 40, including the coupled optical connector 30, to be coupled to a first optical assembly 20, then uncoupled from this first optical assembly 20 and connected to a third optical assembly 220 (as well as by the following being disconnected from the third optical assembly 220 and reconnected to the first optical assembly 20) to form a wide variety of optical devices.
The claims set out in the appendix are not limited to the express and specific compounds, compositions or methods described in the detailed description, which may vary between the particular embodiments which fall within the scope of the claims set out in the appendix. With regard to any type of Markush groups invoked here to describe the peculiarities or aspects of the various embodiments, different, special and / or unexpected results may be obtained from each member of the respective Markush group independently of all others. Markush type members. Each member of a Markush type group can be invoked individually or in combination and it provides adequate support for specific embodiments within the scope of the claims set out in the appendix.
In addition, all the intervals and subintervals invoked to describe the different embodiments of the present invention fall independently and collectively within the scope of the claims set out in the appendix and are supposed to describe and envisage all the intervals, including the whole and / or fractional values, even if these values are not expressly written herein. A person skilled in the art will immediately recognize that the intervals and sub-intervals listed sufficiently describe and make possible various embodiments of the present invention, and these intervals and sub-intervals can be further delimited in relevant halves, thirds, quarters, fifths and and so on. As the only example, an interval ranging from “0.1 to 0.9” can be further delimited in the lower third, ie, from 0.1 to 0.3, middle third, ie d., 0.4-0.6 and above, i.e. 0.7-0.9, which are individually and collectively within the scope of the appended claims and can be invoked individually and / or collectively and provide adequate support for specific embodiments within the scope of the appended claims. Furthermore, with regard to the language which defines or modifies an interval, for example "at least", "greater than", "less than", "not more than" and the like, it should be understood that such language includes subintervals and / or an upper or lower limit. Another example: an interval of "at least 10" intrinsically includes a sub-interval ranging from at least 10 to 35, a sub-interval ranging from at least 10 to 25, a sub-interval ranging from 25 to 35 , and so on and each sub-interval can be invoked individually and / or collectively and it provides adequate support for specific embodiments within the framework of the claims appearing in the appendix. Finally, an individual number in a described range can be invoked and provides adequate support for specific embodiments within the scope of the claims set out in the appendix. For example, an interval from "1 to 9" includes various individual integers, such as 3, as well as individual numbers including a decimal point (or fraction), such as 4.1, which can be invoked and provide adequate support. for specific embodiments within the framework of the claims appearing in the appendix.
The following examples are intended to illustrate the invention and should not be considered in any way as limiting the scope of the invention.
Example 1: Manufacture of the optical connector with one or more hardened bridge parts: An MT 62.5 pm terminal connector with twelve fibers was placed on an assembly unit. The MT connector included a slot having a bottom surface with an end portion of each of the twelve fibers terminating at the fiber interface of the slot, with the fiber interface extending in a direction generally perpendicular to the bottom surface. Twelve 50 x 50 pm polymer waveguides at 250 micrometer (pm) steps were placed in a slot in the MT connector. Each of the terminal ends of the twelve fibers of the MT connector was then aligned with a corresponding terminal end of a respective element of the twelve polymer waveguides by means of a step xyz of submicron precision (<1 µm). After completion of alignment, a gap of 500 µm was established between the terminal ends of the twelve polymer waveguides and the terminal ends of the twelve fibers of the MT connector in the slot.
A drop of a UV photodefinable silicone material with a refractive index of about 1.533 was applied by means of a pipette to the lower surface of the slot in the spacing of the MT connector so that the drop covered each of the respective terminal ends of the fibers of the MT connector and of the polymer waveguides.
The drop of silicone material was selectively polymerized by sending UV light through the fiber interface of one of the twelve fibers of the MT connector. The 375 nm light coming out of the fiber induced about a UV dose of radiation of 1.2 Joule per square centimeter (J / cm ² ) on the photodefinable silicone material to harden part of the drop by radiation, creating the hardened bridge part inside the drop extending from one of the fibers of the MT connector to a corresponding polymer waveguide. The excess uncured material surrounding the hardened bridge part was then removed with toluene and the MT terminals were separated so that the
CH 710 969 B1 hardened bridge remained attached to the polymer waveguide interface. This is how the optical connector was made with one or more hardened bridge parts. The hardened bridge part and the polymer waveguide were then placed on a transparent sheet and imaged by phase contrast microscopy, as illustrated in fig. 15, where the scale indicated is 0.5 mm.
Example 1a: manufacture of another optical connector with one or more hardened bridge parts. Example 1 was repeated in much the same manner as that described above. However, in this example, the drop of silicone material was selectively polymerized by sending UV light through the fiber interface of more than one of the twelve fibers of the MT connector for multiple waveguide bridges on one interface. Thus another optical connector was made with one or more hardened bridge parts. The multiple hardened bridge parts and the polymer waveguides were then placed on a transparent sheet and imaged by phase contrast microscopy, as illustrated in fig. 16, where the scale indicated is 50 pm.
The results illustrated in FIGS. 15 and 16 have demonstrated that one or more hardened bridge parts 62 can be formed according to the methods of the present invention.
Example 2: Manufacture of the optical connector comprising a multiple hardened bridge part: A terminal MT 62.5 pm connector with twelve fibers was placed on an assembly unit. The MT connector included a slot having a bottom surface with an end portion of each of the twelve fibers terminating at the fiber interface of the slot, with the fiber interface extending in a direction generally perpendicular to the bottom surface. Twelve 50 χ 50 µm polymer waveguides in 250 µm steps were placed in a slot in the MT connector. Each of the terminal ends of the twelve fibers of the MT connector was then aligned with a corresponding terminal end of a respective element of the twelve polymer waveguides by means of a step xyz of submicron precision (<1 µm). After completion of alignment, a gap of 500 µm was established between the terminal ends of the twelve polymer waveguides and the terminal ends of the twelve fibers of the MT connector in the slot.
A drop of a silicone material photodefinable by ultraviolet (UV) with a refractive index of about 1.533 was applied by means of a pipette to the lower surface of the slot in the spacing of the connector MT of so that the drop covered each of the respective terminal ends of the fibers of the MT connector and of the polymer waveguides.
The drop of silicone material was selectively polymerized by sending UV light through the fiber interface of more than one of the twelve fibers of the MT connector. The 375 nm light coming out of the fiber induced about a UV dose of radiation of 1.2 Joule per square centimeter (J / cm ² ) on the photodefinable silicone material to harden part of the drop by radiation, creating the hardened bridge part inside the drop extending from one of the fibers of the MT connector to a corresponding polymer waveguide.
Next, a drop of a second UV photodefinable silicone with a refractive index of approximately 1.51 was applied to the uncured part of the first UV photodefinable silicone using a pipette. The second UV photodefinable silicone was then allowed to mix with the uncured portion of the first UV photodefinable material for about 1 minute to form a mixed portion. A second UV curing of approximately 1.2 J / cm ² was applied to the mixed part via a broad spectrum UVA bulb for the radiation curing of the mixed part surrounding each of the bridge parts. hardened.
The polymer waveguides were then separated from the MT 62.5 μm terminal connector with twelve fibers, with the bridge parts hardened and the radiation-hardened mixed part surrounding the hardened bridge parts remaining connected to each of the polymer waveguides. The polymer waveguide was then introduced with the connected hardened bridge parts and the radiation hardened mixed part in an oven and thermally hardened at 130 ° C for about 30 minutes to form the optical connector according to the present invention. Thus, an optical connector was manufactured comprising a part of multiple hardened bridge.
The front face of the optical connector opposite to the waveguides of connected polymers (ie, the terminal end of the optical connector corresponding to the end previously connected to the MT connector 62.5 pm terminal twelve fibers) was then imaged by phase contrast microscopy. The contrast on the micrograph between the hardened bridge part 62 and the hardened mixed part 70 which surrounds it, as illustrated in FIG. 17, where the scale shown is 63 µm, confirmed that the optical connector was formed in which the hardened bridge part had a higher refractive index than the hardened mixed part which surrounded it.
The invention has been described by way of illustration, and it should be understood that the terminology which has been used is intended to be in the nature of the description words rather than of limitation. Obviously, many modifications and variations of the present invention are possible in light of the above teachings. The invention can be carried out other than as specifically described. Calling an example a comparative example does not mean that it is the prior art.

权利要求:
Claims (9)
[1]
claims
1. Method for preparing an optical connector (30) which can be used to connect a respective element of at least one optical element (22) of a first optical assembly (20) to a corresponding element of at least one op18 element
CH 710 969 B1 tick (42) of a second optical assembly (40), in which one or more electromagnetic waves can be guided between the respective element of the at least one optical element (22) of the first optical assembly (20 ) and the corresponding element of the at least one optical element (42) of the second optical assembly (40), in which the optical connector (30) is located in a space (80) between the first optical assembly (20) and the second optical assembly (40) and includes a contrast layer (96) having at least one hardened bridge portion (62) and at least one unhardened bridge portion (98), wherein each of the at least one portion of hardened bridge (62) extends continuously from a terminal end (24) of the at least one optical element (22) of the first optical assembly (20) to a corresponding terminal end (48) of the element corresponding to the at least one optical element (42) of the second optical assembly (4 0), and in which the contrast layer (96) is formed of a first composition having a first refractive index RI ¹ , the method comprising:
applying a second composition having a second refractive index RI ² on the contrast layer (96) to form a second layer;
mixing at least a part of the second layer with the at least one unhardened bridge part (98) of the contrast layer to form at least one mixed part (104) having a third refractive index RI ³ in the contrast layer (96) so that each of the at least one hardened bridge part (62) is at least partially surrounded by a respective element of the at least one mixed part between the terminal end (24) of the at least one optical element (22) of the first optical assembly (20) and the corresponding terminal end (48) of the corresponding element of the at least one optical element of the second optical assembly (40); and applying a hardening condition to harden the at least one mixed portion (104) and prepare the optical connector (30), wherein the first and second compositions and the at least one mixed portion (104) are different from each other, and in which RI ¹ > RI ³ > RI ² when measured at the same wavelength and temperature.
[2]
2. The method of claim 1, wherein in the step of mixing, the entire second layer is mixed with the at least one unhardened bridge portion of the contrast layer to form the at least one mixed or wherein the step of mixing is performed so that each of the at least one hardened bridge portion is surrounded by the respective element of at least one mixed portion between the terminal end of one of the at least one optical element of the first optical assembly and the corresponding terminal end of the corresponding element of the at least one optical element of the second optical assembly.
[3]
3. Method according to one of the preceding claims:
wherein applying the hardening condition to harden the at least one mixed part comprises exposing the at least one mixed part to rays of active energy and preferably exposing the at least one mixed heat part; or wherein the application of the curing condition to cure the at least one mixed part comprises exposing the at least one mixed part to heat, preferably at a temperature ranging from 90 to 260 degrees Celsius.
[4]
4. The method of claim 1, wherein the first and second compositions independently comprise a silicone composition; where the first and second compositions independently comprise:
(A) an organopolysiloxane resin; and (B) a catalyst for improving the hardening of the organopolysiloxane resin.
[5]
5. Method according to one of the preceding claims:
wherein the gap has a length and the length of the gap is between 0 and 1000 microns; preferably, in which the gap has a length and the length of the gap is between 15 and 500 micrometers.
[6]
6. Method according to one of the preceding claims, wherein the respective element of the at least one optical element of the first optical assembly is chosen from the group consisting of an optical fiber, a polymer waveguide, a lens , a transmission module, a reception module and a transceiver; wherein the corresponding element of the at least one optical element of the second optical assembly is chosen from the group consisting of an optical fiber, a polymer waveguide, a lens, a transmission module, a reception module and a transceiver.
[7]
7. Method according to one of claims 1 to 6, wherein the respective element of the at least one optical element of the first optical assembly is the same as the corresponding element of the at least one optical element of the second assembly optical.
[8]
8. Method according to one of claims 1 to 6, wherein the respective element of the at least one optical element of the first optical assembly is different from the corresponding element of the at least one optical element of the second optical assembly .
[9]
9. An optical device comprising an optical connector prepared according to the method of one of claims 1 to 8.

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法律状态:

优先权:

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申请号 | 申请日 | 专利标题

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US201461943029P| true| 2014-02-21|2014-02-21|

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PCT/US2015/012364|WO2015126561A1|2014-02-21|2015-01-22|Method of preparing an optical connector and optical devices comprising the optical connector prepared thereby|

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